Broadpak Corporation Www.broadpak.com

read moreBroadPak CEO delivers plenary talk "Prospect of Panel Level Fan-Out Packaging in the AI/5G Era" at the 21st International Conference on Electronic Packaging Technology (ICEPT 2020). BroadPak presents "SIP Layout Accelerating Silicon Interposer and Wafer Level Fan-Out Design" at the Cadence User Conference, Cadence Live Silicon Valley 2020. BroadPak presents "Chiplet Integration: Tools, Methodology, Requirement, Infrastructure" at the 57th Design Automation Conference (DAC 2020). NIST, Boeing, Cadence and BroadPak presents "DARPA Organic Interposer Characterization" at the DesignCon 2020.

read moreFounded in 2007, BroadPak is the leading provider of 2.5D/3D integration technologies, comprehensive design and development services, and innovative total solutions. BroadPak's mission is to enable and accelerate the development and commercialization of 2.5D/3D semiconductor products and IPs. BroadPak offers cost-effective ultra-high performance 2.5D/3D integration and supply chain ecosystem for mixed process Known Good Die (KGD) and high performance IPs. The company leverages its industry-leading world-class expertise and proven packaging technologies to create competitive advantage for its clients.

read moreSubstrate is the foundation of semiconductor packaging. Substrate design manifests the most critical factor in chip and system performance. Over the years BroadPak has designed and delivered some of the most advanced and lowest cost ultra high performance substrates in the industry for many of the leading companies. With process nodes shrinking, substrate design and performance has become the most critical factor for successful product development. At these nodes substrate design becomes an integral part of the silicon design process and silicon-substrate must be co-designed simoultaniously as one unit.

read moreSan Jose, California, July 9, 2014 - BroadPak, the leading provider of 2.5D/3D integration technologies and comprehensive design and development services used to enable and accelerate the development of green electronic systems, today announced the immediate availability of its tamper-resistant and security-enabled 2.5D/3D packaging technology. This new platform provides trusted security and resilience needed for critical 2.5D/3D system integration and prevents hijacking of critical data. This new technology is shifting the paradigm in semiconductor industry and enables chip makers and system companies to develop new generations of secure products.