Semiconix Semiconductor

SEMICONIX has undertaken the task to redesign and manufacture the future semiconductor components compatible with chip and wire, flip chip, chip scale CSP and surface mount technologies. In today's extreme miniaturization market, there is no more room for the huge packages to protect the die. It means that the bare die has to survive on its own without the protection of a package. Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades.