Business Details
26 Years
experience
Trusted Semiconductor Packaging Solutions in Beaverton
Founded in 2000, Sempac specializes in the design, development, and manufacture of open cavity plastic packages for semiconductors. Our company focuses exclusively on integrated packaging solutions, utilizing RoHS- and REACH-compliant materials to meet industry standards. We prioritize forming lasting partnerships with customers to deliver innovative solutions that address evolving market needs. Our engineering and management teams bring decades of combined experience in semiconductor assembly, materials, and packaging to ensure reliability and quality. We adhere to JEDEC outlines and leverage green molding compounds with Au/Ni plating for superior bondability.By operating independently from traditional contract manufacturing models, we avoid competition with partners and maintain a customer-centric approach. Our solutions cater to high-frequency RF, optoelectronics, and power devices for military and commercial applications. We are committed to exceeding customer expectations through continuous improvement and adherence to rigorous quality standards. Our product lines include QFN, QFP, SOIC, and SSOP packages, available individually or as compatible bundles. With a focus on reducing assembly complexity and storage requirements, we provide cost-effective alternatives to conventional JEDEC-compliant packages.
Services
Semiconductor Packaging
QFN Packages
QFP Packages
SOIC Packages
SSOP Packages
B-Stage Lids
Details
- Year established: 2000
Highlights and features
- We have 50+ years of combined experience in semiconductor assembly and packaging.
- Our packages meet JEDEC standards with RoHS and REACH-compliant materials.
- We offer cost-effective alternatives to traditional JEDEC-compliant packages.
- Our team avoids competing with partners to prioritize customer-centric solutions.
- We reduce assembly complexity with packaging that requires no specialized equipment.
Services
Semiconductor Packaging
Sempac develops open cavity plastic packages for semiconductors, ensuring compliance with JEDEC standards. These solutions reduce assembly complexity and storage requirements while maintaining reliability. Our packaging supports military and commercial applications, including high-frequency RF and power devices.
QFN Packages
Our QFN packages feature compact designs with lead counts ranging from 8 to 40. They use green molding compounds and Au/Ni plating for superior bondability, meeting JEDEC standards for prototyping and testing.
QFP Packages
QFP solutions offer tip-to-tip dimensions from 0.236 to 0.405 inches. These packages provide reliable performance for integrated circuits, adhering to industry standards for commercial and military applications.
SOIC Packages
SOIC packages deliver space-efficient solutions with lead pitches from 0.40 mm to 1.00 mm. Designed for durability, they support diverse electronic applications requiring compact, high-density components.
SSOP Packages
SSOP packages feature fine-pitch leads (0.400.65 mm) and body sizes as small as 3.0 x 3.0 mm. They enable high-density integration in compact electronic devices while maintaining compliance with JEDEC standards.
Questions
What semiconductor packaging solutions does SEMPAC offer?
SEMPAC provides open cavity plastic packages, including QFN, QFP, SOIC, SSOP, and B-Stage Lids, designed for high-frequency RF, optoelectronics, and power devices.
Are SEMPAC's products compliant with industry standards?
Yes, our packages meet JEDEC outlines and use RoHS- and REACH-compliant materials with Au/Ni plating for superior bondability.
How does SEMPAC reduce assembly complexity?
Our packaging solutions eliminate the need for specialized assembly equipment and simplify storage requirements compared to traditional JEDEC-compliant packages.
What markets does SEMPAC serve?
We cater to military and commercial applications, including high-frequency RF, optoelectronics, and power device industries.
Can I purchase SEMPAC products as bundles?
Yes, we offer compatible bundles that include packages, lids, and test sockets for streamlined procurement.
