Business Details
12 Years
experience
Advanced 2.5D/3D Semiconductor Integration Services
Broadpak is a pioneering provider of advanced 2.5D/3D semiconductor integration technologies, dedicated to accelerating the development and commercialization of cutting-edge electronic solutions. Since 2014, we have specialized in comprehensive package design, development, and manufacturing services that enable clients to achieve competitive advantages in high-performance computing, artificial intelligence, and next-generation electronics. Our expertise spans silicon interposer manufacturing, chiplet integration, and heterogeneous packaging, supported by a global ecosystem of partners. We focus on delivering cost-effective, innovative solutions that address the evolving demands of networking, communications, medical, aerospace, defense, and consumer electronics industries. Our team of industry-leading experts leverages deep technical knowledge to provide pathfinding methodologies, advanced substrate co-design, and turnkey manufacturing capabilities.Through rigorous attention to signal-power integrity, thermal-stress management, and reliability testing, we ensure optimal performance for complex semiconductor applications. Our commitment to advancing green technologies aligns with the industry's sustainability goals while maintaining technical excellence. With extensive participation in international conferences and technical symposiums, we remain at the forefront of semiconductor packaging innovation. Our collaborative approach combines client-specific requirements with proven methodologies to deliver scalable solutions for emerging technologies like co-packaged optics and panel-level fan-out packaging. As a trusted partner to global clients, we maintain continuous investment in research and development to address the challenges of AI/HPC, 5G, and deep learning applications through advanced integration technologies.
Services
2.5D/3D Integration
Silicon Interposer Manufacturing
Chiplet Integration
Heterogeneous Packaging
Substrate Co-Design
Wafer-Level Fan-Out
Co-Packaged Optics
Memory Interface Analysis
Package Qualification
AI Accelerator Solutions
Details
- Year established: 2014
Highlights and features
- We offer 10+ years of specialized expertise in 2.5D/3D semiconductor integration
- Our team delivers proven solutions for AI/HPC and 5G packaging challenges
- We provide end-to-end services from pathfinding to manufacturing qualification
- Our silicon interposer expertise includes stress management and reliability testing
- We maintain strategic partnerships for turnkey substrate manufacturing capabilities
Services
2.5D/3D Integration
Our 2.5D/3D integration services enable high-bandwidth memory solutions and chiplet-based architectures. We specialize in through-silicon via (TSV) design, interposer architecture optimization, and heterogeneous integration of photonic and logic components. These solutions address critical challenges in AI accelerators, high-performance computing, and next-generation semiconductor devices.
Silicon Interposer
We provide comprehensive silicon interposer solutions including architectural design, pathfinding, and manufacturing. Our services optimize I/O ring configurations, manage thermal stress, and ensure signal integrity for complex multi-die systems. These capabilities support advanced packaging requirements for high-performance computing and AI applications.
Chiplet Integration
Our chiplet integration expertise covers UCIe, Intel AIB, and custom interface implementations. We offer co-design methodologies, substrate strategies, and manufacturing support for heterogeneous integration. This enables scalable solutions for AI accelerators, photonic packages, and high-density computing systems.
Package Development
We deliver end-to-end package development services including substrate co-design, assembly, and qualification. Our capabilities span wafer-level and panel-level fan-out technologies, memory interface analysis, and reliability testing. These services support the development of advanced packages for 5G, AI, and high-performance computing applications.
Co-Packaged Optics
Our co-packaged optics solutions combine photonic integration with advanced packaging technologies. We provide design methodologies, manufacturing support, and system-level optimization for optical interconnects in high-bandwidth applications. This enables next-generation solutions for data centers and AI accelerators requiring ultra-fast optical connectivity.
People
Farhang Yazdani
CEO
Farhang Yazdani leads Broadpak's strategic direction in advancing 2.5D/3D integration technologies. With extensive industry experience, he has driven the company's participation in major semiconductor conferences and technical innovations in heterogeneous packaging. His leadership focuses on developing scalable solutions for AI accelerators and high-performance computing applications.
Questions
What semiconductor integration technologies do you specialize in?
We specialize in 2.5D/3D integration, silicon interposer design, chiplet integration, co-packaged optics, and heterogeneous packaging solutions for high-performance computing applications.
Which industries benefit from your packaging solutions?
Our solutions serve networking, communications, medical, aerospace, defense, and consumer electronics industries requiring advanced semiconductor packaging technologies.
How do you support AI and high-performance computing?
We provide specialized packaging solutions for AI accelerators, including high-bandwidth memory integration, thermal management, and heterogeneous chiplet architectures optimized for computational performance.
What design and manufacturing services do you offer?
We offer end-to-end services including pathfinding, interposer design, substrate co-design, package assembly, and reliability testing through our global partner ecosystem.
How do you address 5G and AI packaging challenges?
Our panel-level fan-out packaging and advanced interconnect technologies address the thermal, electrical, and mechanical requirements of 5G and AI applications.
What technical conferences have you presented at?
We regularly present at major semiconductor conferences including IMAPS, IEEE ECTC, DAC, and industry symposiums on advanced packaging technologies.
